Multi-layer FET array and method of fabricating

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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C257S712000, C257S713000, C257SE25013, C257SE25017, C257SE23085

Reexamination Certificate

active

10863153

ABSTRACT:
A power array includes a plurality of FET power assemblies and each FET power assembly has at least one field effect transistor mounted to a ciruit board. The circuit boards are arranged atop each other. A power supply pin extends through the circuit boards and is connected to a power input of each field effect transistor. A power output of each FET power assembly is connected to a power output pin which extends through each of the circuit boards. A heat sink is mounted to the power array beneath the lowest FET power assembly and is thermally connected to the field effect transistors of each FET power assembly. A method of assembling a power array including a plurality of FET power assemblies with at least one field effect transistor.

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