Multi in-line memory module and matching electronic...

Details Multi in-line memory module and matching electronic... Multi in-line memory module and matching electronic...

1999-09-23

2002-07-16

Martin, David (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S720000, C361S785000, C361S689000, C439S059000, C439S062000, C439S065000, C174S254000, C174S255000

Reexamination Certificate

active

06421250

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the physical connections and architecture of electronic circuits and more particularly, to in-line memory modules and matching sockets for use in computer systems.
2. Description of the Related Art
Memory modules, such as single in-line memory modules and dual in-line memory modules typically contain multiple semiconductor memory devices. A single in-line memory module employs a single line of metal pins or contacts on one side of the module, and a dual in-line memory module employs two lines of metal pins or contacts on opposite sides of the module. Thus, a dual in-line memory module can accommodate a greater number of metal pins for electrical connection to an external system than a single in-line memory module of the same size. As the functions and structures of computer systems become more complicated and therefore require more contacts and I/O signals, dual in-line memory modules are being used more frequently than single in-line memory modules.
FIG. 1
shows a conventional dual in-line memory module
101
, which includes a printed circuit board
111
on which a plurality of semiconductor memory devices (not shown) are mounted, Two pin blocks
121
and
122
are on printed circuit board
111
for electrically connecting the semiconductor memory devices to an external system. Each of pin blocks
121
and
122
includes a plurality of contact pins
131
. In the conventional dual in-line memory module
101
, the pitch between contact pins
131
must be reduced, or the printed circuit board
111
must be enlarged, to increase the number of pins
131
. However, there is a limit to the reduction of the pitch of pins
131
. Thus, to increase the number of pins
131
, the size of the printed circuit board
111
must be increased.
FIG. 2
shows a conventional electronic component socket
211
mounted on a circuit board
221
. Socket
211
has two pin blocks
231
and
232
with each of pin blocks
231
and
232
a set of metal pins
241
. Pins
241
in socket
211
couple to matching pins
131
on dual in-line memory module
101
of
FIG. 1
when dual in-line memory module
101
is plugged into socket
211
. The semiconductor devices on module
101
electrically connect through pins
131
and
241
to a plurality of semiconductor devices (not shown) on circuit board
221
.
In the conventional dual in-line memory module
101
as described above, increasing the number of pins
131
to accommodate the functionality of semiconductor memory devices mounted on dual in-line memory module
101
requires increasing the size of dual in-line memory module
101
. A larger dual in-line memory module
101
requires a larger socket
211
. Further, any system using dual in-line memory module
101
and electronic component socket
211
must be larger, and the manufacturing cost of the system is increased.
SUMMARY OF THE INVENTION
In accordance with an aspect of the present invention a multi in-line memory module has three or more lines of pins to increase the number of pins on a memory module without increasing the size of the memory module. Further, an accompanying socket for the multi in-line module can accommodate the larger number of pins without a corresponding increase in required system size. In accordance with an embodiment of the invention, a multi in-line module includes a printed circuit board having at least two protrusions formed along one edge. Each of the protrusions has two surfaces suitable for pin blocks, and one pin block is on each surface of the protrusions, although one of the surface can be unused if the module has sufficient pins without using the surface. For memory applications, semiconductor memory devices are mounted on at least one surface of the circuit board, and the pin blocks on the protrusions connect to the semiconductor memory devices via conductive paths inside the protrusions and/or the circuit. In an exemplary embodiment, each of the pin blocks includes a plurality of metal pins, and the surfaces of the protrusions are parallel to the surfaces of the circuit board.
In accordance with another embodiment of the invention, a multi in-line module includes: at least two printed circuit boards each having first and second surfaces. A fixing device connects the printed circuit boards as a single body. With one pin block formed on each surface of the printed circuit broad, the module provides more pins than does a conventional DIMM. Preferably, each of the pin blocks includes a plurality of metal pins, and the fixing device fixes the printed circuit boards parallel to each other. It is also preferable that semiconductor memory devices are mounted on at least one surface of at least one of the printed circuit boards.
In accordance with yet another embodiment of the invention, an electronic component socket includes at least three protrusions formed on a base and pin blocks formed on the side surfaces of the protrusions. Preferably, each of the pin blocks includes a plurality of metal pins. The base and the protrusions are typically dielectrics. The electronic component socket couples to a multi in-line memory module when a board or a protrusion of the module is in each of the gaps between the protrusions of the socket. The base of the socket is typically a printed circuit board on which devices that connect to the module are mounted.
According to an aspect of the present invention, the number of pins available to a memory module can be increased without a proportion increase in size of the memory module.


REFERENCES:
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patent: 4331370 (1982-05-01), Andrews et al.
patent: 4647123 (1987-03-01), Chin et al.
patent: 5112238 (1992-05-01), Cizin
patent: 5270964 (1993-12-01), Bechtolsheim et al.
patent: 5345364 (1994-09-01), Biernath
patent: 5383148 (1995-01-01), Testa et al.
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patent: 5648892 (1997-07-01), Wieloch et al.
patent: 5692910 (1997-12-01), Mittal
patent: 6048213 (2000-04-01), Lai et al.
patent: 1991-0022696 (1991-12-01), None
patent: 1992-016695 (1992-09-01), None

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