Multi function package

Details Multi function package Multi function package

2005-12-20

2005-12-20

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S777000, C257S787000, C257S734000, C257S773000, C438S106000, C438S107000, C438S127000

Reexamination Certificate

active

06977433

ABSTRACT:
A multi-chip package for a computer disc drive. In a preferred embodiment, the multi-chip package (MCP) includes a first die having a buffer function thereon, such as an SDRAM device, and a second die including a channel function and a controller function thereon. The two die are packaged in a single package for placement on a printed circuit board of the disc drive.

REFERENCES:
patent: 6531773 (2003-03-01), Nishizawa et al.
patent: 6602735 (2003-08-01), Shyu
patent: 6604231 (2003-08-01), Kaneko
patent: 6611012 (2003-08-01), Miyamoto et al.
patent: 6617700 (2003-09-01), Lee et al.
patent: 6620648 (2003-09-01), Yang
patent: 6630744 (2003-10-01), Tsuda
patent: 6812726 (2004-11-01), Ong

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