Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-12-29
2010-10-19
Bhatnagar, Anand (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C324S137000
Reexamination Certificate
active
07817845
ABSTRACT:
A method for detecting small cracks and other anomalies on parts having complex geometries is disclosed. The method includes eddy current inspection incorporating collection of data from multi-frequency eddy current signals. Phase analysis is used to combine the multi-frequency data to enhance the signal to noise ratio of the raw inspection image. The image is then reprocessed using a spatiotemporal filter to correlate with the frequency components of the eddy current flaw signal to separate signals associated with cracks and other flaws at edges that would ordinarily be hidden by edge effect signals.
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Dewangan Sandeep Kumar
Gambrell Gigi Olive
McKnight William Stewart
Mishra Peyush Kumar
Pisupati Preeti
Bhatnagar Anand
General Electric Company
Liew Alex
McNees Wallace & Nurick LLC
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