Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-09-09
2010-10-19
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S666000, C257S777000, C257S783000, C257SE25006, C257SE25013, C257SE25021, C257SE25027, C257SE23085
Reexamination Certificate
active
07816775
ABSTRACT:
A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the first side. A second die is attached onto the adhesive. The adhesive fills into the gaps defined by the set of leads. The adhesive is thereafter cured. In a multi-chip integrated circuit package made according to the method, the adhesive attaching the second die fills the gaps between the leads so that to avoid formation of internal cavities of the package.
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Bidin Rahamat
Law Clifton Teik Lyk
Liu Hao
Sun Anthony Yi Sheng
Tan Hien Boon
Clark Jasmine J
Martine & Penilla & Gencarella LLP
United Test and Assembly Center Limited
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