4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Rahamat Bidin

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Leadframe based chip scale package and method of producing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Multi-die IC package and manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2457624

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