Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2005-02-22
2005-02-22
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S782000, C257S784000, C257S776000
Reexamination Certificate
active
06858945
ABSTRACT:
Multi-concentric pad (MCP) arrangements provide for increased pad densities on integrated circuits. The multi-concentric pad (MCP) configuration includes a first set of input output (IO) pads and a second set of IO pads, both disposed on an integrated circuit die. Each IO pad in said first set and said second set of IO pads includes a bond pad for receiving a bond wire connection, and an IO circuit coupled to the bond pad. The IO circuits provide an interface between a signal received at the corresponding bond pad and a core circuit disposed on said IC die. The first set of IO pads are arranged closer to the perimeter of the IC die than the second set of IO pads. Furthermore, the second set of IO pads are arranged so that each IO circuit in the second set of IO pads is closer to the center of the IC die than a corresponding IO circuit in the first set of IO pads.
REFERENCES:
patent: 5543651 (1996-08-01), Sato
patent: 5861662 (1999-01-01), Candelore
patent: 6043539 (2000-03-01), Sugasawara
patent: 6191491 (2001-02-01), Hiraga
patent: 6489688 (2002-12-01), Baumann et al.
Lammers, “LSI Logic Extends Reach of Wire Bond Packaging,”EETIMES, Oct. 22, 2002, pp. 1-3.
Broadcom Corporation
Jackson Jerome
Sterne Kessler Goldstein & Fox P.L.L.C.
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