Multi-component integrated circuit contacts

Details Multi-component integrated circuit contacts Multi-component integrated circuit contacts

2005-08-31

2008-11-04

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C438S614000, C257S779000, C257S780000, C257SE21002

Reexamination Certificate

active

07446028

ABSTRACT:
An integrated circuit connection is describe that includes a first, securing member and a second, connection member. The first member, in an embodiment, is a spike that has a portion of its body fixed in a layer of an integrated circuit structure and extends outwardly from the integrated circuit structure. The second material is adapted to form a mechanical connection to a further electrical device. The second material (e.g., solder), is held by the first member to the integrated circuit structure. The first member increases the strength of the connection and assists in controlling the collapse of second member to form the mechanical connection to another circuit. The connection is formed by coating the integrated circuit structure with a patterned resist and etching the layer beneath the resist. A first member material (e.g.,metal) is deposited. The resist is removed. The collapsible material is fixed to the first member.

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