Multi-compartment eletroplating system

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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Details

204267, 204269, 204273, 204284, 204DIG7, 204270, C25D 1702, C25D 1710, C25D 2110, C25D 2112

Patent

active

053125320

ABSTRACT:
A multi-compartment electroplating system for electroplating two or more objects simultaneously such that the electrodeposited material is substantially uniform in thickness and composition. Electroplating solution is circulated between a reservoir and a multi-compartment tank which has one cathode-paddle-anode (CPA) assembly for each compartment. Each CPA assembly has an anode, a cathode adapted for holding a wafer and employing a single thieving electrode which covers all of the floor of the compartment not covered by the wafer, and a paddle. Also included is a cover which houses a single linear motor for driving all of the paddles in synchrony.

REFERENCES:
patent: 2044415 (1936-06-01), Yates
patent: 3652442 (1972-03-01), Powers et al.
patent: 3862891 (1975-01-01), Smith
patent: 3971710 (1976-07-01), Romankiw
patent: 4049530 (1977-09-01), Tokumoto et al.
patent: 4102756 (1878-07-01), Castellani et al.
patent: 4244788 (1981-01-01), Faulkner
patent: 4619749 (1986-10-01), Nusbaum
patent: 4686014 (1987-08-01), Pellegrino et al.
patent: 4692222 (1987-09-01), Pellegrino et al.
patent: 4695351 (1987-09-01), Mallary
patent: 4772371 (1988-09-01), Lace et al.
patent: 4806224 (1989-02-01), Bruun et al.
patent: 4906346 (1990-03-01), Hadersbeck et al..
patent: 4933061 (1990-06-01), Kulkarni et al.
patent: 5024746 (1991-06-01), Stierman et al.
patent: 5078852 (1992-01-01), Yee et al.
patent: 5100516 (1992-03-01), Nishimura et al.
Bischoff, "Electrochemical Deposition Requirements for Fabricating Thin Film Recording Heads," Magnetic Materials Processes & Devices vol. 90.3.
Berger et al., IBM Technical Disclosure Bulletin, vol. 23, 201 (1980).

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