Multi-chip switch based on proximity communication

Details Multi-chip switch based on proximity communication Multi-chip switch based on proximity communication

2006-06-14

2009-02-10

Myers, Paul R (Department: 2111)

Electrical computers and digital data processing systems: input/

Intrasystem connection

Bus interface architecture

C361S734000, C361S735000

Reexamination Certificate

active

07490189

ABSTRACT:
A switch contains a first semiconductor die, which is configured to receive signals on a plurality of input ports and to output the signals on a plurality of output ports. The first semiconductor die is further configured to selectively couple the signals between the input and output ports using a plurality of switching elements in accordance with a set of control signals, which correspond to a configuration of the switch. During this process, a plurality of proximity connectors, proximate to a surface of the semiconductor die, are configured to communicate the signals by capacitive coupling.

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