Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1990-07-27
1992-04-07
Robinson, Ellis P.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428195, 428220, 428458, 428461, 428419, 4284735, 427 96, 4274071, B32B 300, B32B 700, B32B 1500
Patent
active
051027186
ABSTRACT:
An interconnect substrate that includes a multilevel metal-polymer composite incorporating microelectronic circuitry should be economical to construct when the polymer comprises alternating layers of thermoset and thermoplastic resins, each of which is substantially free from groups that are reactive with copper. The layers of thermoset and thermoplastic resins can either alternate in adjacent levels, or each level can include both a layer of thermoset resin and a layer of thermoplastic resin. When each level includes either a thermoset resin or a thermoplastic resin, each such resin preferably has good machinability to permit each level of the interconnect to be planarized mechanically. When there is a layer of thermoset resin and a layer of thermoplastic resin in each level, the thermoplastic resin preferably is at the surface of each level, because a thermoplastic resin usually has better machinability than do thermoset resins.
REFERENCES:
patent: 4347306 (1982-08-01), Takeda
patent: 4464704 (1984-08-01), Huie
patent: 4508749 (1985-04-01), Brannon
patent: 4594473 (1986-06-01), Inoue
patent: 4681795 (1987-07-01), Tuckerman
patent: 4702792 (1987-10-01), Chow
patent: 4770897 (1988-09-01), Wu
patent: 4770899 (1988-09-01), Zeller
patent: 4810332 (1989-03-01), Pan
patent: 4871619 (1989-10-01), Araps
patent: 4937133 (1990-06-01), Watanabe
Dado Gregory P.
Tingerthal Jeanne M.
Ahmad Nasser
Griswold Gary L.
Kirn Walter N.
Minnesota Mining and Manufacturing Company
Neaveill Darla P.
LandOfFree
Multi-chip substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multi-chip substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-chip substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1894253