Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-04-10
2007-04-10
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S121000, C257SE21499
Reexamination Certificate
active
10877327
ABSTRACT:
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is suitable for attaching to a first semiconductor die and a second conductive strip that is attached suitable for attaching to a second semiconductor die.
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patent: 6316825 (2001-11-01), Park et al.
patent: 6506625 (2003-01-01), Moden
patent: 6650019 (2003-11-01), Glenn et al.
patent: 6713317 (2004-03-01), Knapp et al.
patent: 2004/0061221 (2004-04-01), Schaffer
Carney Francis J.
Celaya Phillip
Fauty Joseph K.
Letterman James P.
St. Germain Stephen
Geyer Scott B.
Hightower Robert F.
Semiconductor Components Industries L.L.C.
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