Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2005-12-06
2005-12-06
Pert, Evan (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
Reexamination Certificate
active
06972487
ABSTRACT:
The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor Substrate used therein. Atop a first semiconductor chip that is a memory chip is mounted a second Semiconductor chip that is a logic chip, with a first functional chip and a second functional chip that together form the first semiconductor chip being joined together via an unsliced scribe line. Additionally, a first functional chip and a second functional chip are given the same chip composition (32-bit memory) and respectively rotated 180 degrees relative to each other. These configurations are intended to improve performance, reduce costs and improve yield.
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Hiraoka Tetsuya
Kato Yoshiharu
Kawamoto Satoru
Takashima Akira
Taniguchi Fumihiko
Armstrong Kratz Quintos Hanson & Brooks, LLP
Pert Evan
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