Multi-chip package semiconductor device and method of...

Details Multi-chip package semiconductor device and method of... Multi-chip package semiconductor device and method of...

2009-04-24

2011-10-18

Thomas, Toniae (Department: 2822)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C257SE21521

Reexamination Certificate

active

08039274

ABSTRACT:
A semiconductor chip may include at least one power supply pad for receiving an external power voltage, at least one input/output pad, an internal function block that may be configured to operate based on a power voltage to at least one of receive and transmit a signal through the input/output pad, and a mode set circuit that may enable or disable the power voltage by a mode set signal in an individual chip test mode.

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patent: 6680212 (2004-01-01), Degani et al.
patent: 11-183548 (1999-07-01), None
patent: 2004-279160 (2004-10-01), None
patent: 10-2003-0019081 (2003-03-01), None
patent: 10-2004-0002441 (2004-01-01), None
patent: 10-2005-0073049 (2005-07-01), None

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