Multi-chip package for LED chip and multi-chip package LED...

Details Multi-chip package for LED chip and multi-chip package LED... Multi-chip package for LED chip and multi-chip package LED...

2008-12-16

2011-10-04

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Plural light emitting devices

C257S099000, C257SE33056, C257SE33062, C257SE33066

Reexamination Certificate

active

08030670

ABSTRACT:
Provided is a multi-chip package light emitting diode (LED) device including a plurality of LED chips within a single package. The LED device may include a base substrate, a multi-chip package for a LED on the base substrate, and a light radiator surrounding the multi-chip package and radiating light emitted by the multi-chip package for a LED, wherein the multi-chip package for a LED may include a plurality of LED chips on a single wafer substrate.

REFERENCES:
patent: 5546496 (1996-08-01), Kimoto et al.
patent: 7055987 (2006-06-01), Staufert
patent: 7728340 (2010-06-01), Unno et al.
patent: 7875899 (2011-01-01), Yasuda
patent: 2004/0233671 (2004-11-01), Staufert
patent: 2005/0073840 (2005-04-01), Chou et al.
patent: 2005/0158894 (2005-07-01), Ohba et al.
patent: 2006/0171135 (2006-08-01), Ishizaka et al.
patent: 2006/0239002 (2006-10-01), Chou et al.
patent: 2007/0013057 (2007-01-01), Mazzochette
patent: 2007/0145381 (2007-06-01), Unno et al.
patent: 2007/0217210 (2007-09-01), Jeong et al.
patent: 2008/0099772 (2008-05-01), Shuy et al.
patent: 2008/0179602 (2008-07-01), Negley et al.
patent: 2008/0211400 (2008-09-01), Kim et al.
patent: 2008/0211416 (2008-09-01), Negley et al.
patent: 2008/0217628 (2008-09-01), Lee et al.
patent: 2009/0108269 (2009-04-01), Negley et al.
patent: 2009/0166644 (2009-07-01), Hiroyama et al.
patent: 2009/0236618 (2009-09-01), Yasuda
patent: 2009/0256494 (2009-10-01), Nishinaka et al.
patent: 2009/0273925 (2009-11-01), Schultz et al.
patent: 2009/0294780 (2009-12-01), Chou et al.
patent: 2009/0296395 (2009-12-01), Tarko et al.
patent: 2010/0006873 (2010-01-01), Raring et al.
patent: 2010/0038662 (2010-02-01), Fushimi et al.
patent: 2010/0117516 (2010-05-01), Shimizu et al.
patent: 2010/0176406 (2010-07-01), Lee
patent: 2010/0213474 (2010-08-01), Hsu et al.
patent: 2010/0219426 (2010-09-01), Kim et al.
patent: 2010/0224904 (2010-09-01), Lee et al.
patent: 2010/0264842 (2010-10-01), Shimizu et al.
patent: 2010/0308301 (2010-12-01), Unno et al.

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