Multi-chip package combining wire-bonding and flip-chip...

Details Multi-chip package combining wire-bonding and flip-chip... Multi-chip package combining wire-bonding and flip-chip...

2006-07-25

2006-07-25

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S784000, C257S786000

Reexamination Certificate

active

07081678

ABSTRACT:
A multi-chip package combining wire-bonding and flip-chip configuration includes a plurality of chips, a substrate and a molding compound. Chip(s) with wire-bonding type and a flip-chip type electrical device are mounted on an upper surface of the substrate. A plurality of contact pads of the substrate are formed on the upper surface of the substrate that are not covered by the molding compound, so the flip-chip type electrical device can be electrically connected to these contact pads. The molding compound has recession(s) from a molding tool and seals the chip(s) with wire-bonding type without damaging the contact pads during molding process.

REFERENCES:
patent: 5847929 (1998-12-01), Bernier et al.
patent: 6191360 (2001-02-01), Tao et al.
patent: 6525406 (2003-02-01), Chung et al.
patent: 6605869 (2003-08-01), Kimura
patent: 6677668 (2004-01-01), Lin
patent: TW466719 (2001-12-01), None

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