Multi-chip package

Details Multi-chip package Multi-chip package

2011-05-03

2011-05-03

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S676000, C257SE23080, C257SE23141, C257SE21502

Reexamination Certificate

active

07936054

ABSTRACT:
A semiconductor package is disclosed. Particularly, a multi-chip package is disclosed, which can stably maintain insulation between a plurality of semiconductor chips and effectively release heat to the outside. The semiconductor package includes an insulation layer including a diamond layer formed by a chemical vapor deposition method between a lead frame or a heat sink and the semiconductor chips disposed thereon.

REFERENCES:
patent: 4731701 (1988-03-01), Kuo et al.
patent: 4751199 (1988-06-01), Phy
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4791473 (1988-12-01), Phy
patent: 4796080 (1989-01-01), Phy
patent: 4830820 (1989-05-01), Itoh et al.
patent: 4839717 (1989-06-01), Phy et al.
patent: 4890153 (1989-12-01), Wu
patent: 5327325 (1994-07-01), Nicewarner, Jr.
patent: 5646446 (1997-07-01), Nicewarner, Jr. et al.
patent: 5650361 (1997-07-01), Radhakrishnan
patent: 5703399 (1997-12-01), Mujamdar et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5776797 (1998-07-01), Nicewarner, Jr. et al.
patent: 5785799 (1998-07-01), Culnane et al.
patent: 6133634 (2000-10-01), Joshi
patent: 6329706 (2001-12-01), Nam
patent: 6432750 (2002-08-01), Jeon et al.
patent: 6489678 (2002-12-01), Joshi
patent: 6556750 (2003-04-01), Constantino et al.
patent: 6566749 (2003-05-01), Joshi et al.
patent: 6574107 (2003-06-01), Jeon et al.
patent: 6621152 (2003-09-01), Choi et al.
patent: 6627991 (2003-09-01), Joshi
patent: 6642738 (2003-11-01), Elbanhawy
patent: 6645791 (2003-11-01), Noquil et al.
patent: 6674157 (2004-01-01), Lang
patent: 6683375 (2004-01-01), Joshi et al.
patent: 6696321 (2004-02-01), Joshi
patent: 6720642 (2004-04-01), Joshi et al.
patent: 6740541 (2004-05-01), Rajeev
patent: 6756689 (2004-06-01), Nam et al.
patent: 6774465 (2004-08-01), Lee et al.
patent: 6777800 (2004-08-01), Madrid et al.
patent: 6806580 (2004-10-01), Joshi et al.
patent: 6830959 (2004-12-01), Estacio
patent: 6836023 (2004-12-01), Joshi et al.
patent: 6867481 (2005-03-01), Joshi et al.
patent: 6867489 (2005-03-01), Estacio
patent: 6891256 (2005-05-01), Joshi et al.
patent: 6891257 (2005-05-01), Chong et al.
patent: 6893901 (2005-05-01), Madrid
patent: 6943434 (2005-09-01), Tangpuz et al.
patent: 6989588 (2006-01-01), Quinones et al.
patent: 6992384 (2006-01-01), Joshi
patent: 7022548 (2006-04-01), Joshi et al.
patent: 7023077 (2006-04-01), Madrid
patent: 7061077 (2006-06-01), Joshi
patent: 7061080 (2006-06-01), Jeun et al.
patent: 7081666 (2006-07-01), Joshi et al.
patent: 7122884 (2006-10-01), Cabahug et al.
patent: 7154168 (2006-12-01), Joshi et al.
patent: 7157799 (2007-01-01), Noquil et al.
patent: 7176506 (2007-02-01), Beroz et al.
patent: 7196313 (2007-03-01), Quinones et al.
patent: 7199461 (2007-04-01), Son et al.
patent: 7208819 (2007-04-01), Jeun et al.
patent: 7215011 (2007-05-01), Joshi et al.
patent: 7217594 (2007-05-01), Manatad
patent: 7242076 (2007-07-01), Dolan
patent: 7256479 (2007-08-01), Noquil et al.
patent: 7268414 (2007-09-01), Choi et al.
patent: 7271497 (2007-09-01), Joshi et al.
patent: 7285849 (2007-10-01), Cruz et al.
patent: 7315077 (2008-01-01), Choi et al.
patent: 7332806 (2008-02-01), Joshi et al.
patent: 7371616 (2008-05-01), Jereza
patent: 7439613 (2008-10-01), Joshi et al.
patent: 7501702 (2009-03-01), Joshi et al.
patent: 7504281 (2009-03-01), Joshi

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