Multi-chip module structure

Details Multi-chip module structure Multi-chip module structure

1988-03-22

1990-05-29

Hille, Rolf

357 74, 357 80, H01L 2316, H01L 3902

Patent

active

049300024

ABSTRACT:
In a pin grid array type multi-chip module structure comprised of a ceramic multi-layer wiring board having the top surface on which a plurality of semiconductor devices are carried, divisional board areas each having the same size are respectively allotted to individual semiconductor devices of the same type. Within respective divisional board areas, the positional relation between the array arrangement of connecting pads on the top surface for connection to the semiconductor devices and the array arrangement of I/O pins on the bottom surface of the board is so determined as to be constant. Metallized patterns inside the board which are to be connected power supply I/O pins and ground I/O pins are made constant for respective divisional board areas allotted to individual semiconductor devices of the same type.

REFERENCES:
patent: 4221047 (1980-09-01), Narken et al.
patent: 4231154 (1980-11-01), Gazdik et al.
patent: 4602271 (1986-07-01), Dougherty, Jr. et al.
patent: 4649417 (1987-03-01), Burgess et al.
patent: 4811082 (1989-03-01), Jacobs et al.
European Search Report from European Application No. EP 88 10 4979.
S. Cherensky, D. Genin and I. Modi, "Electrical Design and Analysis of the Air-Cooled Module (ACM) in IBM System/4381", Nov. 1, 1983, (English Translation Provided).

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