Multi-chip module, semiconductor chip, and interchip...

Details Multi-chip module, semiconductor chip, and interchip... Multi-chip module, semiconductor chip, and interchip...

2005-07-05

2005-07-05

Pham, Hoa (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

C257S686000, C257S700000, C257S777000

Reexamination Certificate

active

06914259

ABSTRACT:
A multi-chip module is implemented by connecting a plurality of connection pads provided on, for example, two semiconductor chips via a plurality of conductive connecting members. To carry out a test for determining the quality of the connection between the two semiconductor chips, the multi-chip module is further provided with a plurality of switch elements so that the plurality of connecting members can be electrically conducted in a serial manner via the connection pads of the semiconductor chips. During the connection test, all the switch elements are turned on, and the impedance between both ends of the line including the plurality of connecting members conducted in a serial manner is measured using two probing pads.

REFERENCES:
patent: 5679609 (1997-10-01), Aimi et al.
patent: 6180426 (2001-01-01), Lin
patent: 2002/0047192 (2002-04-01), Inoue et al.
patent: 58-92230 (1983-06-01), None
patent: 2000-258494 (2000-09-01), None

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