Multi-chip module package

Details Multi-chip module package Multi-chip module package

1999-04-26

2000-10-17

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257786, 257723, 257724, H01L 2304

Patent

active

061336297

ABSTRACT:
A repairable multi-chip module which is used when failures are found after an electrically and functionally testing is described. A substrate is provided. At least a first normal die having a plurality of first pads is mounted on the substrate, wherein the first normal die is surrounded by the pads. At least a failed die is mounted on the substrate. Several third pads and fourth pads are mounted on the substrate, wherein the third pads surrounds the first normal die and the failed die and the fourth pads surrounds the first pads. At least a second normal die having a plurality of second pads is stacked over the failed die. Several conductive wires are electrically connecting the first pads on the first normal die and the third pads. Several reworking conductive wires are electrically connecting the second pads on the second normal die and the fourth pads.

REFERENCES:
patent: 5468997 (1995-11-01), Imai et al.
patent: 5475264 (1995-12-01), Sudo et al.
patent: 5780926 (1998-07-01), Seo
patent: 5841191 (1998-11-01), Chia et al.
patent: 6002178 (1999-12-01), Lin

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