Multi chip module assembly

Details Multi chip module assembly Multi chip module assembly

2006-05-09

2006-05-09

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S017000, C438S108000, C438S107000, C438S127000

Reexamination Certificate

active

07041516

ABSTRACT:
A method of assembling at least a first integrated circuit and a second integrated circuit into a multi chip module. The first integrated circuit is attached and electrically connected to a first substrate to form a first assembly, which is tested to ensure that it functions properly. The second integrated circuit is attached and electrically connected to a second substrate to form a second assembly, which is also tested to ensure that it functions properly. The first assembly is attached and electrically connected to the second assembly to form the multi chip module.

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patent: 6670700 (2003-12-01), Hashimoto
patent: 2001/0006828 (2001-07-01), McMahon

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