Multi-chip module and methods

Details Multi-chip module and methods Multi-chip module and methods

2006-08-01

2006-08-01

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S780000, C257S781000, C257S784000, C438S108000, C438S109000, C438S110000

Reexamination Certificate

active

07084514

ABSTRACT:
A substrate includes first and second regions over which first and second semiconductor devices are to be respectively positioned. The first region is located at least partially within the second region. Contact areas are located external to the first region but within the second region. In one embodiment, in which semiconductor devices are to be stacked over and secured to the substrate in a flip-chip type arrangement, the contact areas correspond to bond pads of an upper, second semiconductor device, while other contact areas located within the first region correspond to bond pads of a lower, first semiconductor device. In another embodiment, the contact areas correspond to bond pads of the first semiconductor device, which are electrically connected thereto by way of laterally extending discrete conductive elements, while other contact areas that are located external to the second region correspond to bond pads of the upper, second semiconductor device.

REFERENCES:
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6084308 (2000-07-01), Kelkar et al.
patent: 6212767 (2001-04-01), Tandy
patent: 6239484 (2001-05-01), Dore et al.
patent: 6337226 (2002-01-01), Symons
patent: 6353263 (2002-03-01), Dotta et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6414381 (2002-07-01), Takeda
patent: 6525413 (2003-02-01), Cloud et al.
patent: 6558978 (2003-05-01), McCormick
patent: 6569709 (2003-05-01), Derderian
patent: 6600221 (2003-07-01), Kimura
patent: 6657290 (2003-12-01), Fukui et al.
patent: 6847105 (2005-01-01), Koopmans
patent: 2003/0189257 (2003-10-01), Corisis et al.
patent: 57-31166 (1982-02-01), None
patent: 62-261166 (1987-11-01), None
patent: 63-128736 (1988-06-01), None

Affiliated with

Also associated with

Rating

Multi-chip module and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-chip module and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-chip module and methods will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3668353