Multi-chip module and methods

Details Multi-chip module and methods Multi-chip module and methods

2005-03-15

2005-03-15

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S786000, C257S783000, C257S787000

Reexamination Certificate

active

06867500

ABSTRACT:
A substrate includes first and second regions over which first and second semiconductor devices are to be respectively positioned. The first region is located at least partially within the second region. Contact areas are located external to the first region, but within the second region. In one embodiment, in which semiconductor devices are to stacked over and secured to the substrate in a flip-chip type arrangement, the contact areas correspond to bond pads of an upper, second semiconductor device, while other contact areas located within the first region corresponding to bond pads of a lower, first semiconductor device. In another embodiment, the contact pads correspond to bond pads of the first semiconductor device, which are electrically connected thereto by way of laterally extending discrete conductive elements, while other contact pads that are located external to the second region correspond to bond pads of the upper, second semiconductor device.

REFERENCES:
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6084308 (2000-07-01), Kelkar et al.
patent: 6212767 (2001-04-01), Tandy
patent: 6239484 (2001-05-01), Dore et al.
patent: 6337226 (2002-01-01), Symons
patent: 6353263 (2002-03-01), Dotta et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6414381 (2002-07-01), Takeda
patent: 6525413 (2003-02-01), Cloud et al.
patent: 6558978 (2003-05-01), McCormick
patent: 20020053727 (2002-05-01), Kimura
patent: 20020096755 (2002-07-01), Fukui et al.
patent: 20030057539 (2003-03-01), Koopmans
patent: 20030189257 (2003-10-01), Corisis et al.
patent: 57-31166 (1982-02-01), None
patent: 62-261166 (1982-02-01), None
patent: 63-128736 (1988-06-01), None

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