Multi-chamber integrated process system

Details Multi-chamber integrated process system Multi-chamber integrated process system

1992-11-20

1994-02-22

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429825, 20429835, 118719, 414217, C23C 1434, B65G 4905

Patent

active

052883795

ABSTRACT:
A vacuum processing apparatus capable of quickly replacing a substrate without opening the two gate valves simultaneously by using two waiting stages and a single transferring robot. The transferring robot is designed to transfer a substrate in a straight-line direction, and those two holding stages are set up in front of and behind the center of rotation of the baseplate of the transferring robot. An integrated module multi-chamber vacuum processing system is provided including a plurality of processing chambers capable of being vacuum evacuated, a substrate transferring chamber capable of being vacuum evacuated, at least one load-lock chamber capable of being vacuum evacuated, a substrate transferring robot assembly for transferring a substrate between the at least one load-lock chamber and the processing chamber disposed within the substrate transferring chamber. The substrate transferring robot assembly comprises a baseplate rotatable with respect to the substrate transferring chamber, two waiting stages integrated on the baseplate to store the substrate temporarily, and a substrate transferring robot mounted on the baseplate for transferring the substrate.

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