Semiconductor device manufacturing: process – Having magnetic or ferroelectric component
Reexamination Certificate
2007-03-27
2007-03-27
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Having magnetic or ferroelectric component
C257SE21665, C365S158000, C365S171000, C365S173000
Reexamination Certificate
active
11152346
ABSTRACT:
In an MRAM and method for fabricating the same, the MRAM includes a semiconductor substrate, a transistor formed on the semiconductor substrate, an interlayer dielectric formed on the semiconductor substrate to cover the transistor, and first and second MTJ cells formed in the interlayer dielectric to be coupled in parallel with a drain region of the transistor, wherein the first MTJ cell is coupled to a first bit line formed in the interlayer dielectric and the second MTJ cell is coupled to a second bit line formed in the interlayer dielectric, and wherein a data line is formed between the first MTJ cell and a gate electrode of the transistor to be perpendicular to the first bit line and the second bit line. The MRAM provides high integration density, sufficient sensing margin, high-speed operation and reduced noise, requires reduced current for recording data and eliminates a voltage offset.
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patent: 6864551 (2005-03-01), Tsang
patent: 6885577 (2005-04-01), Tang et al.
patent: 6891193 (2005-05-01), Schwarz
patent: 2003/0117835 (2003-06-01), Kim et al.
patent: 2004/0211995 (2004-10-01), Park et al.
patent: 2004/0253786 (2004-12-01), Hwang et al.
Lee Seung-jun
Park Wan-jun
Shin Hyung-soon
Le Thao P.
Lee & Morse P.C.
Samsung Electronics Co,. Ltd.
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