Moving head for semiconductor wafer polishing apparatus

Details Moving head for semiconductor wafer polishing apparatus Moving head for semiconductor wafer polishing apparatus

2007-11-13

2007-11-13

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S010000, C451S388000

Reexamination Certificate

active

11532134

ABSTRACT:
Disclosed herein is a moving head for a semiconductor wafer polishing apparatus. The semiconductor wafer polishing apparatus has a table on which a polishing pad is formed, and the moving head mounted via a support unit to hold a wafer relative to a polishing surface of the table. In this case, the moving head includes a sensing means having a load cell and a piezoelectric sensor to measure pressing force and frictional force acting on the wafer provided in the moving head. The present invention relates to the polishing of a semiconductor wafer material from which an integrated circuit is made. That is, the present invention provides a moving head for semiconductor wafer polishing apparatuses, which detects vibrations transmitted to a wafer and outputs signals indicating frictional force and pressing force acting on the wafer, using a load cell and a piezoelectric sensor installed in the moving head so as to maintain optimum frictional force and pressing force relative to the surface of a polishing pad, thus realizing precise final polishing.

REFERENCES:
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5865665 (1999-02-01), Yueh
patent: 5916009 (1999-06-01), Izumi et al.
patent: 6712670 (2004-03-01), de la Llera et al.
patent: 1997-705718 (1997-08-01), None

Affiliated with

Also associated with

Rating

Moving head for semiconductor wafer polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Moving head for semiconductor wafer polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Moving head for semiconductor wafer polishing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3853592