Mounting substrate and semiconductor device

Details Mounting substrate and semiconductor device Mounting substrate and semiconductor device

2006-11-15

2010-11-23

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S678000, C257S734000, C257S779000, C257S772000, C257SE23023, C257SE23079

Reexamination Certificate

active

07838998

ABSTRACT:
A mounting substrate for mounting a semiconductor chip in a flip chip manner, having a plurality of connection pads to which the semiconductor chip is connected, an insulating pattern formed so as to cover a part of the connection pads, and a plurality of dummy patterns for controlling a flow of an underfill infiltrated below the semiconductor chip, characterized in that the plurality of dummy patterns are arranged in staggered lattice shape.

REFERENCES:
patent: 6777814 (2004-08-01), Iwasaki et al.
patent: 2001-15554 (2001-01-01), None
patent: 2004-207296 (2004-07-01), None
patent: 2005-175261 (2005-06-01), None

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