Mounting structure of electronic component having bumps

Details Mounting structure of electronic component having bumps Mounting structure of electronic component having bumps

1998-11-10

1999-10-05

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257738, 257747, 257780, 361742, 438108, H01L 2348

Patent

active

059629258

ABSTRACT:
The mounting structure of an electronic component having bumps includes a multi-layer substrate provided with an outermost layer substrate having electrode on the top thereof and a lower layer substrate comprising at least one layer substrate joining the bottom of the outermost layer substrate, an electronic component having bumps bonded with the electrodes formed on the top of the outermost layer substrate for connecting the electronic component and the substrate, and under-fill resin formed between the electronic component and the outermost layer substrate, in which the coefficient of linear thermal expansion of the under-fill resin is larger than that of the electronic component, but smaller than that of the outermost layer substrate.

REFERENCES:
patent: 4970575 (1990-11-01), Soga et al.
patent: 5863815 (1999-01-01), Egawa

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