Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-10-15
2001-05-01
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C704SE21020, C704SE21020, C704SE21020, C704SE21020, C704SE21020, C704SE21020, C165S080200, C165S080300, C174S016100, C174S016300, C257S678000, C257S706000, C257S707000
Reexamination Certificate
active
06226179
ABSTRACT:
CLAIM OF PRIORITY
This application makes reference to, incorporates the same herein, and claims all benefits accruing under 35 U.S.C. § 119 from an application entitled MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE MODULE FOR A COMPUTER SYSTEM earlier filed in the Korean Industrial Property Office on Oct. 17, 1999, and there duly assigned Ser. No. 43526/1998, a copy of which is annexed hereto.
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention concerns a structure for mounting a semiconductor device module in a printed circuit board of a computer system, and more particularly concerns a structure for mounting a semiconductor device module in a motherboard of a computer system.
2. Background of the Invention
Computer systems are information handling systems that are utilized by many individuals and businesses today. A computer system can be defined as a microcomputer that includes a central processing unit (CPU), a volatile memory, a non-volatile memory such as read only memory (ROM), a display monitor, a keyboard, a mouse or other input device such as a trackball, a floppy diskette drive, a compact disc-read only memory (CD-ROM) drive, a modem, a hard disk storage device, and a printer. A computer system's main board, which is a printed circuit board known as a motherboard, is used to electrically connect these components together. A computer system can be a desktop computer, a personal computer, a portable computer such as a notebook computer or palm-sized computer, or other type of computer.
Generally, a semiconductor device module refers to a packaged functional assembly consisting of a cache memory, central processing unit (CPU) and other electronic components mounted on a small printed circuit board (PCB). Such a semiconductor device module requires a particular mounting structure which is different from that used for mounting a standard CPU in the motherboard.
Meanwhile, one of the important factors that must be considered for the mounting structure is the user's upgradablity of the semiconductor device module with the development of the semiconductor technology.
I have found that a replacement of semiconductor device module can be difficult and inconvenient. Efforts have been made to improve coupling an integrated circuit to a printed circuit board.
Exemplars of recent efforts in the art include U.S. Pat. No. 5,926,370 for method and APPARATUS FOR A MODULAR INTEGRATED APPARATUS FOR MULTI-FUNCTION COMPONENTS issued to Cromwell, U.S. Pat. No. 5,919,259 for METHOD AND APPARATUS FOR SUPPLYING POWER TO A CPU USING ANADAPTOR CARD issued to Dahl, U.S. Pat. No. 5,705,932 for SYSTEM FOR EXPANDING SPACE PROVIDED BY TEST COMPUTER TO TEST MULTIPLE INTEGRATED CIRCUITS SIMULTANEOUSLY issued to Fredrickson, U.S. Pat. No. 5,369,879 for METHOD OF MOUNTING A SEMICONDUCTOR DEVICE TO A HEAT SINK issued to Goeschel, et al., U.S. Pat. No. 5,287,617 for APPARATUS FOR EXTRACTING AN INTEGRATED CIRCUIT PACKAGE INSTALLED IN A SOCKET ON A CIRCUIT BOARD issued to Murphy, U.S. Pat. No. 4,748,495 for HIGH DENSITY MULTI-CHIP INTERCONNECTION AND COOLING PACKAGE issued to Kucharek, and U.S. Pat. No. 4,084,242 for ELECTRONIC POSTAGE WEIGHING SCALE issued to Conti.
While these recent efforts provide advantages, I note that they fail to adequately provide a mounting structure of a semiconductor device for a computer system.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a mounting structure for readily mounting or detaching a semiconductor device module to or from the motherboard of a computer system, and in addition effectively dissipating the heat generated from the chip set.
According to an embodiment of the present invention, a mounting structure for mounting a semiconductor device module in a computer system, comprises a housing for mounting a motherboard having peripheral ports for connecting with various peripheral devices, an opening formed in the housing for allowing the semiconductor device module to be mounted on or detached from the motherboard, a plurality of fasteners positioned between the motherboard and semiconductor device module for fixing the semiconductor device module on the motherboard, each of the fasteners having two end parts being respectively connected with the motherboard and semiconductor device module, and a rear bracket attached to one side of the housing for supporting the peripheral ports and additionally serving as an electromagnetic interference preventer, wherein the rear bracket further includes an extension plate placed beneath the mother board to face the part ofthe motherboard mounted with the semiconductor device module, and a plurality of bosses formed on the extension plate so as to respectively hold the end parts of the fasteners connected with the motherboard.
Preferably, an additional chip set is mounted on the lower surface of the motherboard so as to face the extension plate. A heat sink pad is attached to the extension plate so as to contact the chip set. Each of the fasteners includes a first fixing part connected through one of board fixing holes formed in the motherboard with the corresponding boss of the rear bracket, a second fixing part connected with one of module fixing holes formed in the semiconductor device module so as to correspond with the board fixing holes from the lower surface of the semiconductor device module, the second fixing part having a female threaded hole to receive a screw for fixing the semiconductor device module against the motherboard, and a middle support formed between the first and second fixing parts for supporting the semiconductor device module.
To achieve these and other objects in accordance with the principles of the present invention, as embodied and broadly described, the present invention provides an apparatus, comprising: a housing having a plurality of peripheral ports removably coupling with a plurality of peripheral devices; a printed circuit board being mounted to said housing, said housing forming an aperture allowing a semiconductor unit to be mounted to and detached from a first surface of said printed circuit board; a plurality of fasteners being positioned between said printed circuit board and the semiconductor unit fixing the semiconductor unit onto the first surface of said printed circuit board, each one of said fasteners having a first end part coupled with the semiconductor unit and a second end part coupled with said printed circuit board; a rear bracket being attached to a side of said housing supporting said peripheral ports and blocking electromagnetic interference; and said rear bracket including a plate extending adjacent to a second surface of said printed circuit board, said plate forming a plurality of bosses to respectively receive said second end parts of said fasteners coupling with said printed circuit board.
To achieve these and other objects in accordance with the principles of the present invention, as embodied and broadly described, the present invention provides an apparatus mounting a semiconductor unit in a computer system, comprising: a housing; a printed circuit board being mounted to said housing, said housing forming an aperture allowing the semiconductor unit to be mounted to and detached from said printed circuit board; a plurality of fasteners being positioned between said printed circuit board and the semiconductor unit fixing the semiconductor unit onto said printed circuit board, each one of said fasteners having an upper end part penetrating a respective hole formed by the semiconductor unit and a lower end part penetrating a respective hole formed by said printed circuit board; and a rear bracket being attached to a side of said housing and including a plate extending adjacent to said printed circuit board, said plate forming a plurality of bosses to respectively receive said lower end parts of said fasteners penetrating said printed circuit board.
To achieve these and other objects in accordance with the principles of the present invention, as embodied and broadly described, the present invention provides an ap
Bushnell , Esq. Robert E.
Picard Leo P.
Samsung Electronics Co,. Ltd.
Vortman Anatoly
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