Mounting structure in integrated circuit module

Details Mounting structure in integrated circuit module Mounting structure in integrated circuit module

2007-06-05

2007-06-05

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S686000, C257SE25013, C257SE23063

Reexamination Certificate

active

10988390

ABSTRACT:
Embodiments of the present invention may include an integrated circuit module structure for a high-density mounting. An embodiment may include a wiring board, having a mounting space with a mounting length determined in a first direction and a mounting width determined in a second direction, on at least one surface thereof, and a plurality of integrated circuit packages having a package mounting combination length longer than the mounting length of the wiring board. An embodiment may also have some packages among the plurality of integrated circuit packages mounted directly on the mounting space, while other packages are mounted indirectly on the mounting space. The present embodiment may have packages that are overlapped horizontally and vertically distant from one another. Embodiments allow a plurality of chips or packages to be mounted in a limited area without changing a form factor of integrated circuit module even when integrated circuit chip or package size increases.

REFERENCES:
patent: 5684677 (1997-11-01), Uchida et al.
patent: 5904497 (1999-05-01), Akram
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6169325 (2001-01-01), Azuma et al.
patent: 6351028 (2002-02-01), Akram
patent: 6836011 (2004-12-01), Azuma
patent: 2002/0081838 (2002-06-01), Bohr

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