Mounting structure for semiconductor element

Details Mounting structure for semiconductor element Mounting structure for semiconductor element

2011-05-24

2011-05-24

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257SE23010, C257SE23040, C257SE23145, C257SE31117, C257SE23043, C257S667000, C257S796000, C257S671000, C257S672000, C257S670000, C257S730000, C257S784000, C257S786000, C257S676000

Reexamination Certificate

active

07948091

ABSTRACT:
A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a paste adhesive onto the surface of the die pad and placing the semiconductor element on the die pad so as to press and spread the adhesive between the lower surface of the semiconductor element and the die pad. A wire extends between the semiconductor element and a terminal pad disposed around the die pad. The die pad includes plural grooves in the surface thereof. Each of the grooves extends from the center of the die pad toward a peripheral edge of the die pad and ends at the inner side of the peripheral edge of the die pad.

REFERENCES:
patent: 5378656 (1995-01-01), Kajihara et al.
patent: 5397915 (1995-03-01), Nose
patent: 5744224 (1998-04-01), Takeuchi et al.
patent: 5874773 (1999-02-01), Terada et al.
patent: 6516994 (2003-02-01), Takahashi
patent: 6965157 (2005-11-01), Perez et al.
patent: 7550828 (2009-06-01), Ramakrishna et al.
patent: 2001/0054640 (2001-12-01), Takahashi
patent: 2002/0027270 (2002-03-01), Iwakiri
patent: 2002/0145180 (2002-10-01), Terui et al.
patent: 2002/0195692 (2002-12-01), Yamada et al.
patent: 2003/0006055 (2003-01-01), Chien-Hung et al.
patent: 2004/0232528 (2004-11-01), Ito et al.
patent: 2008/0283978 (2008-11-01), Aripin et al.
patent: 63-153827 (1988-06-01), None
patent: 01-297828 (1989-11-01), None
patent: 06-061276 (1994-03-01), None
patent: 09-199517 (1997-07-01), None
patent: 63-239967 (1998-10-01), None
Japanese Patent Office Action dated Jan. 4, 2011 in Application No. 2006-345532.
Patent Abstracts of Japan, Publication No. 06-061276, published Mar. 4, 1994.
Patent Abstracts of Japan, Publication No. 09-199517, published Jul. 31, 1997.
Patent Abstracts of Japan, Publication No. 63-239967, published Oct. 5, 1998.

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