Mounting structure for integrated circuit

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S015000, C361S783000, C257S724000

Reexamination Certificate

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07154759

ABSTRACT:
In a mounting structure of an integrated circuit, an electrolytic capacitor for smoothing power of a heating element is disposed out of range of thermal effect of the heating element, and a ceramic capacitor for supplementing the operation of the electrolytic capacitor is additionally disposed between the electrolytic capacitor and the heating element. Accordingly, a long lifespan of the electrolytic capacitor and a stable operation of the heating element can be guaranteed.

REFERENCES:
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patent: 6304447 (2001-10-01), Bortolini et al.
patent: 6411524 (2002-06-01), Chen et al.
patent: 6466454 (2002-10-01), Jitaru
patent: 6492773 (2002-12-01), Gyoten et al.
patent: 6577066 (2003-06-01), Kominami et al.
patent: 6879488 (2005-04-01), Takeda et al.
patent: 11-261258 (1999-09-01), None
patent: 2000-261125 (2000-09-01), None
patent: 2002-0077065 (2002-10-01), None

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