Mounting structure for an integrated circuit

Details Mounting structure for an integrated circuit Mounting structure for an integrated circuit

1997-06-30

1999-10-26

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361792, 361748, 361764, 361750, 361751, 361765, 361767, 361772, 257701, 257774, 257700, 257686, 257782, 257783, H05K 702

Patent

active

059739274

ABSTRACT:
A mounting structure for an integrated circuit device comprises a first substrate, a second substrate and an insulator. The first substrate contains conductive wiring electrically connected to the integrated circuit device. The first substrate is mounted on the second substrate which have a ground pattern. The insulator is provided between the conductive wiring and the ground pattern.

REFERENCES:
patent: 4975761 (1990-12-01), Chu
patent: 5574630 (1996-11-01), Kresge et al.
patent: 5637920 (1997-06-01), Loo
patent: 5767575 (1998-06-01), Lan et al.

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