Mounting structure for a semiconductor chip having a buffer laye

Details Mounting structure for a semiconductor chip having a buffer laye Mounting structure for a semiconductor chip having a buffer laye

1992-03-23

1993-03-16

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257753, H01L 2312, H01L 2314

Patent

active

051949342

ABSTRACT:
A semiconductor device is comprised of glass substrate, an epoxy-phenol resin for buffer means formed on the glass substrate, a set of electrical wiring provided on the epoxy-phenol resin and a semiconductor chip provided with a bump of gold and bonded to the electric wiring with therebetween chip provided with the bump therebetween using a photo-cured type of an epoxy resin.

REFERENCES:
patent: 4352120 (1982-09-01), Kurihara et al.
patent: 4556899 (1985-12-01), Kurihara et al.
patent: 4643526 (1987-02-01), Watanabe et al.
patent: 4672421 (1987-06-01), Liz
patent: 4729010 (1988-03-01), Tsuchiya et al.
patent: 4744637 (1988-05-01), Sekimura et al.
patent: 4826297 (1989-05-01), Kubo et al.
patent: 4855872 (1989-08-01), Wojnar et al.
patent: 4872047 (1989-10-01), Fister et al.

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