Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-07-24
2007-07-24
Thai, Luan (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S676000, C257SE23061, C257SE23039, C257SE23066, C257S728000, C257SE23067
Reexamination Certificate
active
11031659
ABSTRACT:
A chip package having a lead frame, a chip, a plurality of bonding wires, and an insulation material is provided. The lead frame comprises a die pad, a plurality of leads, a plurality of signal pads and a plurality of non-signal pads. The signal pads and non-signal pads are underneath the signal leads and non-signal leads respectively. The non-signal pad is directly connected to a non-signal plane in the circuit board through its own vias. The signal pad has a structure which extends toward its adjacent non-signal pads. With the signal pad size enlarged, the capacitance between the non-signal plane in the circuit board and the signal pad is increased. The increased capacitance compensates the inductance induced from the bonding wires and improves the response of the signal propagation path for RF applications.
REFERENCES:
patent: 6191494 (2001-02-01), Ooyama et al.
patent: 6455355 (2002-09-01), Lin et al.
patent: 6713849 (2004-03-01), Hasebe et al.
patent: 7049696 (2006-05-01), Kubo
Jiang Shin-Shing
Lee Sheng-Yuan
J.C. Patents
Thai Luan
VIA Technologies Inc.
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