Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-09-27
2005-09-27
Wilson, Christian (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000, C257S669000, C257S735000
Reexamination Certificate
active
06949814
ABSTRACT:
A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.
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Hori Tetsuji
Komatsu Izuru
Tadauchi Masahiro
Tateishi Hiroshi
Teshima Koichi
Kabushiki Kaisha Toshiba
Menz Douglas
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Wilson Christian
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