Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2000-01-03
2001-10-02
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S773000
Reexamination Certificate
active
06297141
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to mounting assemblies of integrated circuit devices and methods for production thereof and more particularly, to a mounting assembly of an integrated circuit device in which an interconnection between an integrated circuit device and a mounting substrate is not exposed and also to a method for production thereof.
2. Description of the Related Art
An example of this type of prior art mounting assemblies of integrated circuit devices is disclosed in PCT International Publication Number 6-504408/94.
In
FIG. 13
of the above Publication, a semiconductor chip assembly includes an integrated circuit device having a plurality of input/output terminals provided on the periphery of its top surface and a sheetlike interposer which is mounted on the integrated circuit device and has a plurality of bonding terminals provided on its periphery and connected to the plurality of input/output terminals of the integrated circuit device respectively. Provided on the sheetlike interposer are a plurality of terminals for external connection which are connected to the plurality of bonding terminals through wires, respectively. The input/output terminals of the integrated circuit device and the plurality of bonding terminals of the sheetlike interposer are interconnected by respective bonding wires.
The above prior art has such a problem that, since the input/output terminals of the integrated circuit device and the plurality of bonding terminals of the sheetlike interposer are interconnected by respective bonding wires, the bonding wires are externally exposed. This leads to another problem that the bonding tends to be easily separated, resulting in reduced reliability of the package.
In addition, since the bonding wires connecting the plurality of input/output terminals of the integrated circuit device and the plurality of bonding terminals of the sheetlike interposer are provided separately, a long manufacturing time is required.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a mounting assembly of an integrated circuit device which can avoid exposure of an interconnection between the integrated circuit device and a wiring substrate on which the integrated circuit device is to be mounted.
Another object of the present invention is to provide a mounting assembly of an integrated circuit device in which interconnections between a plurality of input/output terminals of the integrated circuit device and a plurality of connecting terminals of a wiring substrate on which the integrated circuit device is to be mounted can be carried out simultaneously.
Yet another object of the present invention is to provide a mounting assembly of an integrated circuit device which can realize a firm interconnection between the integrated circuit device and a wiring substrate on which the integrated circuit device is to be mounted.
A further object of the present invention is to provide a mounting assembly of an integrated circuit device in which interconnections between the integrated circuit device and a wiring substrate, on which the integrated circuit device is to be mounted, can be easily, visually observed.
In accordance with an aspect of the present invention, the above objects can be attained by providing a mounting assembly of an integrated circuit device which comprises the integrated circuit device having input/output terminals on its underside surface, a substrate, on which the device is mounted, through-holes formed in a substrate at positions opposed to the input/output terminals of the integrated circuit device, and a connecting member for connecting the input/output terminals of the integrated circuit device and the through-holes.
The mounting assembly of the integrated circuit device has electrodes provided in the through-holes, wires connected to the electrodes, and a plurality of terminals provided on the bottom side of the substrate to be connected to the wires. The plurality of terminals are arranged in a lattice form.
As a connecting member, solder or electrically conductive resin may be employed.
Further, the substrate may have an external size smaller than or the same as the integrated circuit device, the connecting member may be exposed externally from the through-holes, and the connecting member exposed externally from the through-holes may be used as a connecting terminal.
In accordance with another aspect of the present invention, there is provided a method for manufacturing a mounting assembly of an integrated circuit device which includes the integrated circuit device having a plurality of input/output terminals provided on its underside and a substrate, in which, through-holes are provided at positions opposed to the input/output terminals of the integrated circuit device, said method comprising the steps of providing solder for each of the plurality of input/output terminals of the integrated circuit device, aligning the plurality of through-holes of the substrate with the plurality of input/output terminals of the integrated circuit device, and heating the integrated circuit device and substrate to melt the solder.
In accordance with a further aspect of the present invention, there is provided a method for manufacturing a mounting assembly of an integrated circuit device which includes the integrated circuit device having a plurality of input/output terminals provided on its bottom side and a substrate, in which through-holes are provided at positions opposed to the input/output terminals of the integrated circuit device, said method comprising the steps of providing a connecting member to each of the plurality of input/output terminals of the integrated circuit device, aligning the plurality of through-holes of the substrate with the plurality of input/output terminals of the integrated circuit device, and simultaneously effecting all the interconnections between the plurality of input/output terminals of the integrated circuit device and the plurality of through-holes of the substrate.
The above and other objects, features, and advantages of the present invention will become apparent from the following description referring to the accompanying drawings which illustrate an example of a preferred embodiment of the present invention.
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Hoang Quoc
NEC Corporation
Nelms David
Sughrue Mion Zinn Macpeak & Seas, PLLC
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