Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Patent
1998-03-23
1999-08-10
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
257780, 257781, 257783, 257786, 257714, 361767, 361768, 361771, 174261, H05K 118, H05K 114
Patent
active
059363096
ABSTRACT:
A mounted structure of printed circuit board in semiconductor package, the mounted structure comprising a solder resist formed with at least more than one tunnel connecting outsides with respective pads of printed circuit board mounted with substrate, whereby the solder resist is improved in construction thereof to allow the flux gas to be easily extracted for prevention of generation of void.
REFERENCES:
patent: 5493075 (1996-02-01), Chong et al.
Brown Peter Toby
Duong Hung Van
Samsung Electronics Co,. Ltd.
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