Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1992-10-23
1994-01-04
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156643, H01L 21306, B44C 122
Patent
active
052756831
ABSTRACT:
A wafer mount is arranged in a process chamber of the plasma etching apparatus. The rim section of a susceptor which serves as a mount body is curved at a large curvature radius. An electrostatic chuck sheet is arranged on the top of the susceptor and its rim is curved downward along the curved rim section of the susceptor, departing from the marginal portion of a semiconductor wafer mounted thereon as it comes outward. The rim of the electrostatic chuck sheet can be thus shortened in the horizontal direction and this enables a conductive film in the electrostatic chuck sheet to be made longer in the same direction. The electrostatic and thermal connection of the wafer to the electrostatic chuck sheet can be thus enhanced.
REFERENCES:
patent: 5078851 (1992-01-01), Nishihata et al.
patent: 5147497 (1992-09-01), Nozawa et al.
Arami Jun-ichi
Fukasawa Kazuo
Ito Takashi
Powell William A.
Tokyo Electron Limited
Tokyo Electron Yamanashi Limited
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