MOSFET with isolation structure and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C438S199000

Reexamination Certificate

active

07923787

ABSTRACT:
A MOSFET with an isolation structure is provided. An N-type MOSFET includes a first N-type buried layer and a P-type epitaxial layer disposed in a P-type substrate. A P-type FET includes a second N-type buried layer and the P-type epitaxial layer disposed in the P-type substrate. The first, second N-type buried layers and the P-type epitaxial layer provide isolation between FETs. In addition, a plurality of separated P-type regions disposed in the P-type epitaxial layer further provides an isolation effect. A first gap exists between a first thick field oxide layer and a first P-type region, for raising a breakdown voltage of the N-type FET. A second gap exists between a second thick field oxide layer and a second N-well, for raising a breakdown voltage of the P-type FET.

REFERENCES:
patent: 5548147 (1996-08-01), Mei
patent: 5852314 (1998-12-01), Depetro et al.
patent: 7262471 (2007-08-01), Pan et al.
patent: 2002/0171103 (2002-11-01), Spadea
patent: 2004/0227183 (2004-11-01), Negoro et al.
patent: 1155764 (1997-07-01), None

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