MOS transistor with gate trench adjacent to drain extension...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S288000, C257S365000, C257S366000

Reexamination Certificate

active

07893499

ABSTRACT:
An integrated circuit containing an MOS transistor with a trenched gate abutting an isolation dielectric layer over a drift region. The body well and source diffused region overlap the bottom surface of the gate trench. An integrated circuit containing an MOS transistor with a first trenched gate abutting an isolation dielectric layer over a drift region, and a second trenched gate located over a heavily doped buried layer. The buried layer is the same conductivity type as the drift region. A process of forming an integrated circuit containing an MOS transistor, which includes an isolation dielectric layer over a drift region of a drain of the transistor, and a gate formed in a gate trench which abuts the isolation dielectric layer. The gate trench is formed by removing substrate material adjacent to the isolation dielectric layer.

REFERENCES:
patent: 2008/0054325 (2008-03-01), Takahashi et al.
patent: 2009/0140343 (2009-06-01), Feilchenfeld et al.
patent: 2009/0179272 (2009-07-01), Campi et al.

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