Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2007-12-11
2007-12-11
Ngô, Ngân V. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S395000, C257S396000, C257SE21540
Reexamination Certificate
active
11249400
ABSTRACT:
After an isolation region is formed using a field-forming silicon nitride film, this silicon nitride film is patterned, thereby a gate trench is formed. Next, a gate electrode material is buried into the gate trench, and this is etched back. Thereafter, the silicon nitride is removed, thereby a contact hole is formed. A contact plug is buried into this contact hole. With this arrangement, the contact plug can be formed without using a diffusion layer contact pattern. At the same time, the periphery of the contact plug substantially coincides with a boundary between the element isolation region and the active region. Accordingly, the active region can be reduced.
REFERENCES:
patent: 2006/0220110 (2006-10-01), Lai et al.
patent: 2007/0007563 (2007-01-01), Mouli
patent: 2002-43544 (2002-02-01), None
patent: 2002-110930 (2002-04-01), None
Elpida Memory Inc.
McDermott Will & Emery LLP
Ngo Ngan V.
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