MOS-technology power device integrated structure and manufacturi

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257329, 257341, 257382, 257384, 257412, 438156, 438268, 438514, 438586, 438647, 438652, 438694, H01L 2976, H01L 21265

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057985545

ABSTRACT:
A MOS-technology power device integrated structure includes a first plurality of elongated doped semiconductor stripes of a first conductivity type formed in a semiconductor layer of a second conductivity type, each including an elongated source region of the first conductivity type, an annular doped semiconductor region of the first conductivity type formed in the semiconductor layer and surrounding and merged with the elongated stripes, insulated gate stripes extending over the semiconductor layer between adjacent elongated stripes, a plurality of conductive gate fingers extending over and electrically connected to the insulated gate stripes, and a plurality of source metal fingers, each one extending over a respective elongated stripe and contacting the elongated stripe and the respective elongated source region, so that the source metal fingers and the conductive gate fingers are interdigitated.

REFERENCES:
patent: 4015278 (1977-03-01), Fukuta
patent: 4055884 (1977-11-01), Jambotkar
patent: 4072975 (1978-02-01), Ishitani
patent: 4145700 (1979-03-01), Jambotkar
patent: 4344081 (1982-08-01), Pao et al.
patent: 4345265 (1982-08-01), Blanchard
patent: 4376286 (1983-03-01), Lidow
patent: 4399449 (1983-08-01), Herman et al.
patent: 4412242 (1983-10-01), Herman et al.
patent: 4414560 (1983-11-01), Lidow
patent: 4593302 (1986-06-01), Lidow
patent: 4605948 (1986-08-01), Martinelli
patent: 4642666 (1987-02-01), Lidow et al.
patent: 4680853 (1987-07-01), Lidow
patent: 4705759 (1987-11-01), Lidow et al.
patent: 4716126 (1987-12-01), Cogan
patent: 4798810 (1989-01-01), Blanchard et al.
patent: 4816882 (1989-03-01), Blanchard et al.
patent: 4901127 (1990-02-01), Chow et al.
patent: 4927772 (1990-05-01), Arthur et al.
patent: 4931408 (1990-06-01), Hshieh
patent: 4959699 (1990-09-01), Lidow et al.
patent: 4963972 (1990-10-01), Shinohe et al.
patent: 4974059 (1990-11-01), Kinzer
patent: 5008725 (1991-04-01), Lidow
patent: 5130767 (1992-07-01), Lidow et al.
patent: 5160985 (1992-11-01), Akiyama
patent: 5164804 (1992-11-01), Terashima
patent: 5191396 (1993-03-01), Lidow et al.
patent: 5208471 (1993-05-01), Mori et al.
patent: 5286984 (1994-02-01), Nakagawa et al.
patent: 5338961 (1994-08-01), Lidow et al.
patent: 5382538 (1995-01-01), Zambrano
patent: 5489799 (1996-02-01), Zambrano
European Search Report from European Patent Application No. 95830454.5, filed Oct. 30, 1995.
European Search Report from European Patent Application 95830418.0, filed Oct. 9, 1996.
European Search Report from European Patent Application No. 95830468.5, filed Nov. 6, 1995.
European Search Report from European Patent Application No. 95830453.7, filed Oct. 30, 1995.
European Search Report from European Patent Application 95830542.7, filed Dec. 28, 1995.
Patent Abstracts of Japan, vol. 015, No. 442 (E-1131), Nov. 11, 1991 & JP-A-03 185737 (Toshiba Corp.)
Patent Abstracts of Japan, vol. 011, No. 231 (E-527), Jul. 28, 1987 & JP-A-62 047162 (Matsushita Electric Works Ltd.).
Patent Abstracts of Japan, vol. 014, No. 038 (E-878), Jan. 24, 1990 & JP-A-01 272163 (Fuji Electric Co. Ltd.).
Patent Abstracts of Japan, vol. 017, No. 039 (E-1311), Jan. 25, 1993 & JP-A-04 256367 (Hitachi Ltd.).
Patent Abstracts of Japan, vol. 017, No. 213 (E-1356), Apr. 26, 1993 & JP-A-04 349660 (Toshiba Corp).
Patent Abstracts of Japan, vol. 008, No. 053 (E-231), Mar. 9, 1984 & JP-A-58 206174 (Tokyo Shibaura Denki KK).
Semiconductor Science and Technology, Apr. 1993, UK, vol. 8, No. 4, oo 488-494, Galvagno., et al. "Diffusion and Outdiffusion of Aluminum Implanted into Silicon".
Stanford Electronics Laboratories, Integrated Circuits Laboratory, Stanford University, Stanford, CA, Technical Report No. 4956-1, Mar. 1976, Michael Donald Pocha, "High Voltage Double Diffused MOS Transistors for Integrated Circuits" pp. 229-240.
IEEE Journal of Solid-State Circuits, vol. SC-11, No. 4, Aug. 1976, Isao Yoshida, et al., "A High Power MOSFET With a Vertical Drain Electrode and a Meshed Gate Structure", pp. 472-477.
Siliconix Technical Proposal in response to N.A.F.I., Solicitation #N00163-77-R-1197, Aug. 31, 1977, Labor and Materials to Design, Develop and Fabricate a 500V/2A N-Channel Metal Oxide Semiconductor F.E.T.
IEEE Transactions On Electron Devices, vol. ED-27, No. 2, Feb. 1980, S.C. Sun, et al., "Modeling of The On-Resistance of LDMOS, VDMOS, and VMOS Power Transistors", pp. 356-367.
International Electron Devices Meeting--Tech. Digest, Dec. 8-10, 1980, Washington, D.C., pp. 91-94, J. Mena, et al., "High Frequency Performance of VDMOS Power Transistors".
Solid State Electronics, vol. 27, No. 5, pp. 419-432, 1984, P. McGregor, et al, "Small-Signal High-Frequency Performance of Power MOS Transistors" No Month.
IEEE Transactions on Electron Devices, vol. ED-31, No. 1, Jan. 1984, pp. 109-113, Jose G. Mena, et al., "Breakdown Voltage Design Considerations in VDMOS Structures".
Solid State Electronics, vol. 29, No. 6, pp. 647-656, 1986, Jose G. Mena et al., "High-Voltage Multiple-Resistivity Drift-Region LDMOS" No Month.
Solid State Electronics, 1977, vol. 29, pp. 875-878, Surinder Krishna, "Second Breakdown in High Voltage MOS Transistors" No Month.
Electronic Design, For Engineers and Engineering Managers--Worldwide, pp. 8276-8282, "HEXFET, A New Power Technology Cuts On-Resistance, Boosts Ratings" No Date.
ICS and Semiconductors, pp. 8272-8275 No Date.
Laid Open Patent Specification No. 85073/80, Laid Open Date: Jun. 26, 1980, Patent No. 75/162,677, Kanushiki Kaisha Hitachi Seisakusho, "Methods for Manufacturing Insulated Gate Type Field Effect Transistors".
European Search Report from European Patent Application 95830055.0, filed Feb. 24, 1995.
Patent Abstracts of Japan, vol. 014 No. 387 (E-0967), Aug. 21, 1990 & JP-A-02 143566 (Toshiba Corp.) Jun. 1, 1990.
European Search Report from European Patent Application 95830535.1, filed Dec. 22, 1995.
Mena J., et al., "High Frequency Performance of VDMOS Power Transistors", International Electron Devices Meeting, Technical Digest, Washington, D.C., USA, 8-10 Dec. 1980, 1980 New York, NY, USA.
Patent Abstracts of Japan, vol. 005, No. 040 (E-049), Mar. 17, 1981 & JP-A-55 163877 (Toshiba Corp.).

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