MOS field effect transistor and its manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S402000, C257S403000

Reexamination Certificate

active

06229188

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a MOS field effect transistor (hereinafter referred to as MOSFET) that operates with low power consumption and at a high speed and which can be, used as a memory device and a switching device in computers. It also relates to the manufacturing method of the MOSFET of the present invention.
2. Prior Arts
Miniaturization of a MOSFET faces difficult problems such as short channel effects in particular. This phenomenon is characterized by lowered threshold voltage. For a given channel doping concentration, as the channel length is reduced, the depletion layer extending towards the gate becomes to serve as an additional depletion layer to the depletion layer at the drain electrode and subsequently reduces the depletion layer at the gate, which eventually lowers the threshold voltage of the device. In addition to this phenomenon, there is a problem in a CMOS structure of latch-up which is a parasitic bipolar action. One approach to avoid latch-up is to increase the impurity concentration of the substrate thereby reducing the resistance of the substrate. However, if the impurity concentration is increased to such a level as to prevent the latch-up, the threshold voltage increases to an undesirable level. Also, if the impurity concentration in the channel region where carriers traverse is high, the effect of scattering by the impurity atoms increases generally resulting in lowered carrier mobility.
SUMMARY OF THE INVENTION
The object of the invention therefore is to solve the problems accompanied with such conventional devices as described hereinabove. In accordance with the invention, a substrate of high impurity doping concentration is used to prevent short channel effects and latch-up, and an epitaxial growth layer with low impurity doping concentration is provided at the channel region to obtain high operation speed and to control threshold voltage.


REFERENCES:
patent: 56-94670 (1981-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

MOS field effect transistor and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MOS field effect transistor and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MOS field effect transistor and its manufacturing method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2520439

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.