Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-09-10
2009-10-20
Lee, Sin J. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S905000, C430S910000, C430S330000, C430S325000, C430S326000, C526S287000, C526S228000, C564S254000
Reexamination Certificate
active
07604919
ABSTRACT:
The photoresist monomer including an oxime group, a polymer thereof and a photoresist composition containing the same are disclosed. The photoresist monomer is represented by following Formula.In Formula, R* is independently a hydrogen or a methyl group, and R is a substituted or unsubstituted C1˜C25alkyl group with or without an ether group, or a substituted or unsubstituted C4˜C25hydrocarbon group including an aryl group, a heteroaryl group, a cycloalkyl group or a multicycloalkyl group with or without an ether group, a ketone group or a sulfur.
REFERENCES:
patent: 2004/0033440 (2004-02-01), Maeda et al.
patent: 2008/0102402 (2008-05-01), Lee et al.
Kim Deog-Bae
Kim Jae-Hyun
Kim Sang-Jung
Lee Jae-Woo
Lee Jung-Youl
Birch & Stewart Kolasch & Birch, LLP
Dongjin Semichem Co., Ltd.
Lee Sin J.
LandOfFree
Monomer, polymer and composition for photoresist does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Monomer, polymer and composition for photoresist, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Monomer, polymer and composition for photoresist will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4108240