Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1995-10-26
1997-03-25
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257528, H01L 2900
Patent
active
056147570
ABSTRACT:
A monolithic multilayer ultra thin chip inductor is manufactured with two terminals on the same end of the component to reduce the mechanical stresses caused by a coefficient of expansion mismatch. A third no-connect terminal located on the opposite end may be used to mount the component when a more rigid connection is required. The inductor is constructed using a bottom and top coil layer, each having a coil and forming a termination point corresponding to the inductor terminals. The opposite ends of the coils form connection ends and are electrically connected to form a continuous coil from one terminal to the other. Optionally, a number of intermediate coil layers can be included between the bottom and top coil layers. The coil layers are selected from a set of coil layers. As a result, the total number of coil turns can be obtained by selecting the appropriate coil layers.
REFERENCES:
patent: 5446311 (1995-08-01), Ewen et al.
Adelman Jeffrey T.
Person Herman R.
Tschosik Bruce A.
Veik Thomas L.
Zwick Scott D.
Dale Electronics, Inc.
Jr. Carl Whitehead
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