Monolithic IC and MEMS microfabrication process

Details Monolithic IC and MEMS microfabrication process Monolithic IC and MEMS microfabrication process

2011-01-25

2011-01-25

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S053000, C438S054000, C438S056000, C438S704000, C438S705000, C438S706000, C257S415000, C257S416000, C257S417000, C257S418000, C257S419000

Reexamination Certificate

active

07875484

ABSTRACT:
Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and micro-electromechanical devices are built on separate areas of a single wafer. The sequence of IC and MEMS process steps is designed to prevent alteration of partially completed circuits and devices by subsequent high process temperatures.

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