Monocrystalline silicon wafer

Details Monocrystalline silicon wafer Monocrystalline silicon wafer

1988-06-28

1991-08-27

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156662, C03C 1500

Patent

active

050430440

ABSTRACT:
A silicon wafer in which a plurality of semiconductor devices are to be formed is disclosed. The silicon wafer has a convex front surface before a process step for forming the semiconductor devices is conducted. The shape of the convex is designed such that during process steps to form and to complete the semiconductor devices in the silicon wafer, the shape of the front surface usually maintains convex conditions without changing to a concave condition.

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