Monitoring system for dicing saws

Details Monitoring system for dicing saws Monitoring system for dicing saws

1999-12-01

2000-12-26

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 5, B24B 4900

Patent

active

06165051&

ABSTRACT:
A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a sensor for determining a speed of a blade of the dicing saw. A monitor determines a load placed on the blade by the substrate, where the monitor measures at least one of a feedback control current and a feedback control voltage output from the dicing saw. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.

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S. Malkin, Grinding Technology, Ellis Horwood Ltd., 1989, pp. 129-139.

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