Monitoring system for dicing saws

Details Monitoring system for dicing saws Monitoring system for dicing saws

1998-10-29

2000-03-07

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 5, B24B 4900

Patent

active

060332883

ABSTRACT:
A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a spindle motor with a blade attached to the spindle motor. A spindle driver is coupled the spindle to drive the spindle at a predetermined rotation rate. A sensor is connected to the spindle motor to determine the rotation rate of the spindle. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.

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S. Malkin, Grinding Technology, Ellis Horwood Ltd., 1989, pp. 129-139.

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